The global DRAM module and components market was valued at USD 94.9 billion in 2021 and is expected to reach USD 110.7 billion by 2027, at a CAGR of 1.2% during the forecast period from 2022 to 2027. The key factors driving the growth of the DRAM module and components market include emergence of 5G technology, growth in demand for DRAM module and components in automotive sector, growth in adoption of high-end smartphones, and others.

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Based on type, the DRAM module and components market includes Double Data Rate Two DRAM (DDR2 DRAM), Double Data Rate Three DRAM (DDR3 DRAM), Double Data Rate Fourth DRAM (DDR4 DRAM), Double Data Rate Fifth DRAM (DDR5 DRAM), Low-Power DRAM (LPDRAM), High-Bandwidth Memory (HBM), Graphic Dual Data Rate (GDDR), and others, which include Single Data Rate DRAM (SDR DRAM), Double Data Rate DRAM (DDR DRAM), and Reduced Latency DRAM (RLDRAM). LPDRAM Module and Component segment holds the largest market share in the DRAM module and components market by type and is expected to retain its position during the forecast period owing to the increasing applications of these DRAMs in battery-operated devices such as smartphones and tablets. The demand for smartphones and tablets is increasing rapidly every year, increasing the demand for LPDRAM module and component as well.

Based on end-user industries, the DRAM module and components market has been segmented into consumer electronics, servers, mobile devices, computers, automobiles, and others. The servers segment is expected to hold the largest market share of the DRAM module and components market during the forecast period due to the increasing number of network users in the current highly connected IT world. The number of servers and data centers is increasing rapidly to manage the growing crowd over the network.

Among all regions, APAC holds the largest market share and is expected to retain its position owing to countries such as China and South Korea, which are global manufacturers and consumers of DRAM module and components, along with its application segments, such as mobile devices, servers, computers, and consumer electronics.

Some of the key companies operating in the DRAM module and components market are Samsung Electronics Co., Ltd. (South Korea), SK Hynix Inc. (South Korea), Micron Technology, Inc. (US), Nanya Technology Corporation (Taiwan), Winbond Electronics Corporation (Taiwan), Powerchip Technology Corporation (Taiwan), ADATA Technology Co. Ltd. (Taiwan), Ramaxel Technology (Shenzhen) Co, Ltd (China), Kingston Technology Corporation (US), SMART Modular Technologies (US), and so on.