4-6 layers is expected to remain the largest segment in the global high-
density interconnect (HDI) PCB market
An exciting new study from the team of Lucintel found that high-density interconnect
(HDI) PCB market is expected to reach $19.1 billion by 2027 with a CAGR of 4.7%.
There are significant money making opportunities available in this market and
companies planning to enter this market need to differentiate in order to maximize their
return on investment.
Download Brochure of this report by clicking on https://www.lucintel.com/high-density-
interconnect-printed-circuit-board-market.aspx
The high-density interconnect (HDI) PCB market is segmented based on end use
industry, technology, build-up layer count, and region. In this market, 4-6 layers is
expected to remain the largest technology, and smartphones segment is expected to
remain the largest end use industry. Players can benefit from the available opportunities
like the increasing electronic content in automotive and growth in consumer electronic
devices & telecommunication products.
Miniaturization of electronic devices and growing demand for low loss/high-speed HDI
PCBs are emerging trends having impact on dynamics of the industry.
TTM Technologies, Inc., Tripod Technology Corporation, AT&S, Kingboard Holdings
Ltd., CCTC, DG Shengyi Electronics, Dynamic Electronics Co. Ltd., Gold Circuit
Electronics, Olympic, DAP, Unimicron Technology Corp.,Compeq Manufacturing Co.,
Ltd., Ibiden Co., Ltd., Zhen Ding Technology Holding Limited, Unitech, Samsung
Electro-Mechanics, and Meiko Electronics Co. Ltd. are some of the major players
profiled in this 195 page report.
Request Sample Pages by clicking on https://www.lucintel.com/high-density-
interconnect-printed-circuit-board-market.aspx

Some of the Key Questions answered in this exclusive report are:
Q.1 What are some of the most promising, high-growth opportunities for the high-
density interconnect (HDI) PCB market by end use industry (smartphones and tablets,
computers, telecom/datacom, consumer electronics, automotive, and others),
technology (4-6 layer, 8-10 layer, and 10+ layer), build-up layer count (1+n+1, 2+n+2,
3+n+3, and others), and region (North America, Europe, Asia Pacific, and the Rest of
the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 What are the business risks and threats to the high-density interconnect (HDI) PCB
market?
Q.4 What are some changing demands of customers in the high-density interconnect
(HDI) PCB market?
Q.5 What are the new developments in the high-density interconnect (HDI) PCB
market? Which companies are leading these developments?
Q.6 What strategic initiatives are being implemented by key players for business
growth?
Q.7 What are some of the competitive products and processes in this high-density
interconnect (HDI) PCB area and how big of a threat do they pose for loss of market
share via product substitution?
Q.8 What M&A activity has occurred in the last 5 years in this high-density interconnect
(HDI) PCB market?
This unique report from Lucintel will enable you to make confident business decisions in
this globally competitive marketplace. For a detailed table of contents, contact Lucintel
at +1-972-636-5056 or click on this link [email protected]
About Lucintel

Lucintel, the premier global management consulting and market research firm, creates
winning strategies for growth. It offers market assessments, competitive analysis,
opportunity analysis, growth consulting, M&A, and due diligence services to executives
and key decision-makers in a variety of industries. For further information, visit
www.lucintel.com.
Brandon Fitzgerald
Lucintel
Dallas, Texas, USA
Email: [email protected]
Tel. 972.636.5056
Cell: 303.775.0751
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