An exciting new study from the team of Lucintel found that system in package market is expected to grow at a CAGR of 8% to 10%. There are significant money making opportunities available in this market and companies planning to enter this market need to differentiate in order to maximize their return on investment.
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The system in package market is segmented based on device type, packaging method, package type, packaging technology, application, and region. In this market, RF front end is expected to remain the largest device type, and consumer electronics segment is expected to remain the largest application. Players can benefit from the available opportunities like increasing demand in consumer electronics and increasing presence of major players.
Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group are some of the major players profiled in this 150 page report.
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Some of the Key Questions answered in this exclusive report are:
Q.1 What are some of the most promising potential, high-growth opportunities for the global system in package market by packaging technology (2D IC, 2.5D IC, 3D IC), packaging method (fan-out wafer level packaging, wire bond & die attach, and flip chip), package type (ball grid array, surface mount package, pin grid array, flat package, and small outline package), device type (RF front-end, RF power amplifier, power management integrated circuits, baseband processor, application processor, microelectromechanical system, and others), application (automotive & transportation, healthcare, communication, aerospace & defense, industrial, consumer electronics, and other), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 What are the business risks and threats to the system in package market?
Q.4 What are some changing demands of customers in the system in package market?
Q.5 What are the new developments in the system in package market? Which companies are leading these developments?
Q.6 What strategic initiatives are being implemented by key players for business growth?
Q.7 What are some of the competitive products and processes in this system in package area and how big of a threat do they pose for loss of market share via product substitution?
Q.8 What M&A activity has occurred in the last 5 years in this system in package market?
This unique report from Lucintel will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link [email protected]
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Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.