The global semiconductor bonding market size is projected to grow USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% during the forecast period. Factors such as growing demand for MEMs and surge in demand for electric vehicle are driving the growth of the market during the forecast period.

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Notable R&D investments and technological advances have increased the demand for reliable and high-performance miniaturized electronic components, such as microelectromechanical systems (MEMS) and microoptoelectromechanical systems (MOEMS), from high-growth and high-value industries, including aerospace, military, automotive, consumer electronics, and medical. Die bonder equipment are extensively being used for the assembly and packaging of MEMS and MOEMS devices. MEMS and MOEMS devices find applications in sensors, robotics, microvalves, flow controllers, global positioning systems (GPS), and biotechnology. The microfabrication capability of die bonders makes them ideal for the assembly and packaging of MEMS and MOEMS.

Driver: Increasing adoption of stacked die technology in IoT devices

The semiconductor bonding market is experiencing growth due to the increasing use of stacked die technology in IoT devices. Stacked die involves attaching bare die on top of each other within a single semiconductor package, which allows for multiple functionalities to be used in the same placement area on a substrate. This results in better electrical performance of devices, as the shorter routing of interconnections between circuits leads to faster signal generation. Original equipment manufacturers (OEMs) in the semiconductor industry are interested in exploiting the benefits of IoT beyond connectivity.

Opportunity: Expanding IC industry in China

The growth of the wafer bonding market can be attributed to the increasing demand for thin wafers in the semiconductor industry. Thin wafers have advantages such as ultra-low power consumption and ultra-high electrical performance, and have helped overcome many traditional fabrication processes. Chinese IC manufacturers are interested in leveraging this technology due to the need for thin chips that offer high performance at a low operating voltage and low cost. As a result, wafer bonding and other thin wafer technologies are gaining popularity among Chinese IC manufacturers such as Hisilicon Technologies, Co., Ltd., Spreadtrum Communications, and RDA Microelectronics.

APAC exhibit the highest CAGR during the forecast period

The APAC region is expected to continue dominating the semiconductor bonding market in terms of size and CAGR in the coming years. This is due to the presence of a large number of foundries, IDM, and OSAT companies in the region, as well as the headquarters of major IDMs and foundry players across the world. The increasing number of IDMs in the region is also expected to boost market growth in the near future. Additionally, the mass production of electronic products such as smartphones, wearables, and white goods in China and Taiwan is expected to accelerate the market's growth in the APAC region.

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Increasing demand for 3D semiconductor assembly and packaging

The increasing use of 3D chip modules is expected to drive the semiconductor bonding market in the near future. 3D ICs are manufactured by stacking two or more semiconductors vertically, using different bonding methods such as adhesive, soft soldering, and eutectic. Other than taking less space, 3D packaging offers high product performance and lower power consumption. Die bonders ensure a smooth bonding process by offering micro-level precision, which is required for the fabrication of 3D chip modules. The growing adoption of 3D semiconductor components, increasing competition among outsourced semiconductor assembly and testing (OSAT) companies and foundries, and rising demand for MEMS and MOEMS from the automotive industry are expected to boost the growth of the semiconductor bonding market in the near future. 3D ICs are used in RF transmitters and transceivers, which are critical components of mobile devices.

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