Hermetic Packaging Market Size, Share | Industry Trends Report – 2023


Posted September 19, 2019 by stevestark002

Hermetic Packaging Market by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Geography - Global Forecast to 2023
 
According to the forecast provided by MarketsandMarkets, the overall hermetic packaging market is estimated at USD 3.25 Billion in 2018 and is expected to reach USD 4.52 Billion by 2023, growing at a CAGR of 6.80% between 2018 and 2023. The key factors driving this market is growing need of protecting highly sensitive electronic components from extraneous particles, such as moisture, atmospheric pressure, and soil/grime; and strong demand for hermetically packaged components from the industries such as automotive, electronics, and aeronautics.

This report segments the hermetic packaging market on the basis of configuration, type, application, industry, and geography. The market, on the basis of configuration, is driven by high adoption rate of the multilayer ceramic packages for high frequency applications such as data communication, wireless communication, and optical communication, as multilayer ceramic packages offer better hermeticity than other configurations for high-frequency applications, and also enable a large number of electrical feedthroughs within small spaces.
The hermetic market for ceramic-metal (CERTM) sealing is expected to hold a major share and grow at the highest CAGR between 2018 and 2023. Growing demand for thermal shock-resistant and low-porosity type of hermetic packaging material is the key factor that propels the growth of the said market. The CERTM sealed sensors, such as heating-ventilation-air conditioning (HVAC) sensors, chassis level sensors, and differential non-contacting sensors, are finding potential applications in the automotive industry as they assure the safety of the passengers while offering failure-free operation.

Based on application, the market for transistors is expected to hold a major share during the forecast period. The hermetically sealed transistors are mainly used for designing telecommunication circuits and home appliances. This is a key driving factor for the said market. However, the market for microelectromechanical system (MEMS) switches is expected to grow at the highest rate during the forecast period.

The market in APAC is expected to hold the largest market share and also projected to grow at the highest CAGR between 2018 and 2022. Increasing energy needs (backed by the high GDP growth rates) in developing countries, such as China and India, is creating huge opportunities for manufacturers of hermetically packaged electronic components in APAC. China, Japan, and India, among others, are now stepping up in space research activities, such as satellite launches and space exploration missions, which is expected to add to the high growth of the hermetic packaging market in APAC during the forecast period.

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The major challenges for the companies in the market are the high infrastructure cost incurred by controlled and regulated packaging environment and competition from near-hermetic packaging. SCHOTT AG (Germany), AMETEK (US), Amkor Technology (US), Texas Instruments (US), Teledyne Microelectronics (US), Kyocera Corporation (Japan), Materion Corporation (Japan), Egide (France), Micross Components (US), Legacy Technologies Inc. (US) are the major players that adopt various strategies such as new product developments; mergers and acquisitions; partnerships, agreements, and collaborations to cater to the needs of customers.

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Issued By Steve
Phone 8886006441
Business Address 630 Dundee Road
Suite 430
Country United States
Categories Semiconductors
Tags hermetic packaging market
Last Updated September 19, 2019