In the production process, each PCB board is usually composed of drill holes, lines, and solder mask (some company factories also call it solder mask). Each factory will simply process the customer file to make the customer file meet the production standards in the factory (the model and service life of the equipment are different and the process capability varies from factory to factory), and then issue the production file to the production site. Complete customer needs.

The processing of files is usually done by engineers. Due to different technical abilities, CAM engineers generally use the CAM software they are best at to complete the job. The commonly used CAM software is GENESIS CAM350 and so on. Due to the technical level, if the designer has certain irregularities in the design of customer documents, some engineers will not be able to make correct judgments.

E.g:

1. The design of the outline is not clear. Some designers have designed outlines in the keep layer, line solder mask, etc. If the size and shape of these outlines are different, it will affect the engineer to make a correct judgment and cannot make a correct judgment. Appearance affects customer usage.

2. Drilling usually uses hard alloy material to drill the position and size required by the customer on the substrate to achieve direct layer penetration, heat dissipation, and subsequent processing at the subsequent station or after the finished product is used by the customer for positioning and alignment use, a (If the designer designs a heavy hole in the same place, the CAM engineer does not find it during production, which will result in continuous drilling in the same place during on-site drilling, which is time-consuming and labor-intensive to accelerate the wear of the drill bit and waste costs. Drilling multiple times at the place will cause the drill bit to break and cause damage to the hole. b (If the designer does not pay attention to locking the hole in the production process when designing the PCB version, it may cause the hole to be unable to be drilled and affect the customer experience.

3. The design of the layers is inconsistent with the actual requirements. For example, the design of the multi-layer board is named according to L1, L2, L3, and L4, but the actual need is that L1 is top and L2 is bottom. If there is no special remark, it will also affect engineers. Good judgment in processing data. It is also inconvenient to have the double-sided component surface on the bottom layer and the solder surface on the top layer.

4. The circuit layer is designed with a grid. Due to the different process capabilities of each factory, the distance between the lines forming the network will also affect the quality of the circuit board if it is too small. ) If the line spacing is less than 0.2mm, the line may not be able to be etched. If the spacing of dense coil design is less than 0.2 and there are too many lines, the circuit board may be burned during electroplating.

5. The filling area of the circuit layer or the pad is drawn with very thin lines, because the pad is drawn with a line by line. When the data is first processed, the amount of data will be large and the operation will be very slow. Depending on the size of the pad and the The shape may change as the data is processed.

6. Treatment of solder mask process Some customers will choose the bare copper process. Although the bare copper process is cheap and has good solderability, it is easy to oxidize, which will easily lead to false soldering or that the pads and components cannot be soldered. Therefore, during production We will choose a surface treatment process. (The company's common processes include tin spraying, anti-oxidation, and chemical immersion gold). If you use other special processes that require special requirements, you should ask whether the in-house process capability can be achieved when placing an order, and make special remarks. . Because the cost of different surface treatment processes is also different, it is relatively appropriate to choose the appropriate one according to the required occasion. First of all, the tin-sprayed board is chosen more because of its low price and good welding performance, but the reason for the poor surface flatness of the tin-sprayed board is not suitable for welding circuit boards with small components. The cost of the anti-oxidation process is also low, and the flatness and weldability of the board surface are very good. It will not be easily oxidized, but it is also easily affected by humidity and acid. The immersion gold process is not easy to oxidize, can be stored for a long time, and the surface is flat and can be used for the welding of small components, but the cost is high and the welding strength is not very good.

7. Irregular characters, small characters or overlapping characters will make the printed characters indistinguishable. If the characters are placed on the pad, the characters will appear on the pad. If the engineer forgets to move the components, the components cannot be welded.

8. Regarding the treatment of broken copper in the circuit layer, the copper skin smaller than a certain unit area is generally called broken copper skin or small copper skin. During production and processing, these copper skins without any network connection may be etched due to the problem of etching degree. Dropping or changing the shape causes the difference with the customer's file. In order to prevent this from affecting the customer's experience, it is recommended that the designer delete the broken copper skin or increase the treatment during the design.

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