The global Silicon on Insulator market is projected to reach USD 2.3 billion by 2026 from an estimated USD 1.1 billion in 2021, at a CAGR of 17.2% from 2021 to 2026. The rising demand for 5G in mobile communications and the increasing adoption of AI and ML in consumer electronics are the major driving factors for the growth of the SOI market.

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The 300 mm segment held the major share of the SOI market, in 2021.

In 2021, the 300 mm segment is expected to hold a larger share of the SOI market than the 200 mm and less than 200 mm, and a similar trend is expected to be observed during the forecast period. The 300 mm segment is also expected to record a higher CAGR during the forecast period. The growth of the market for the 300 mm segment can be attributed to the increasing global demand for smartphones, consumer electronics, automobiles, and IoT devices as 300 mm wafers are mainly used in these applications. Moreover, the rising demand for 300 mm SOI wafers is also driven by their use in emerging applications such as image sensors, and the requirement for high data transmission speed in data centers. Companies are also focusing on investments to increase the production capacity for 300 mm SOI wafers.

The market for FD-SOI segment is expected to grow at the highest CAGR during the forecast period

The FD-SOI wafers segment is anticipated to record the highest CAGR during the forecast period. The high growth of FD-SOI wafers is attributed to the adoption of FD-SOI wafers owing to their high flexibility, easy implementation, low cost, less complexity, and reduced leakage currents, as well as their ability to optimize power/performance tradeoffs. Several FD-SOI wafer manufacturers are focusing on new product launches and collaborations with other players in the SOI market to strengthen their product portfolio and to cater to the increasing demand for FD-SOI wafers.

The smart cut segment held the major share of the SOI market, in 2020.

In 2020, the smart cut technology segment held the largest share of the SOI market, and a similar trend is likely to be observed during the forecast period. The growth of smart cut technology is attributed to its adoption in a large industrial platform including major SOI wafer manufacturing companies across the world. Smart cut is the proprietary technology of Soitec. The company licenses this technology to major SOI manufacturers such as Globalwafers Co., Ltd., Shin-Etsu Chemical Co. Ltd., and SUMCO Corporation. Moreover, the rising demand for smart cut technology in the manufacturing of SOI wafers of size 200 mm and less than 200 mm, and 300 mm is also driving the growth of this segment. Smart cut technology enables on-wafer thickness uniformity of ± 1 nm with overall distribution, on all wafers.

The RF FEM products segment held the major share of the SOI market, in 2020.

In 2020, the RF FEM products segment held the largest share of the SOI market. The growth of the RF FEM products segment can be attributed to the rising demand for front-end modules in 5G technology, as well as consumer electronic devices such as smartphones, laptops, and tablets. RF FEM is one of the most critical designs in 4G LTE-A and 5G smartphones and base stations. Acting as an interface between the antenna and RF transceiver, the FEM integrates the RF components required for analog performance, such as multiple RF switches (used in both Tx and Rx paths), low-noise amplifiers (LNAs), power amplifiers (PAs), and antenna tuners. The rising demand for RF silicon content in the latest smartphones due to the increasing use of multiple antenna elements in 5G technology is also driving the growth of the market for the RF FEM product segment. Companies are focusing on leveraging this demand by developing an RF-SOI product portfolio.

The automotive application segment of the SOI market is projected to grow at the highest CAGR from 2021 to 2026

The SOI market for automotive applications is projected to grow at the highest CAGR during the forecast period. This growth of the automotive application is attributed to the initiatives taken by the leading players in the SOI ecosystem such as Soitec to deploy FD-SOI and power-SOI wafer-based chips in autonomous vehicles, infotainment systems, and advanced driver-assistance systems (ADAS). Moreover, leading automotive manufacturers such as BMW, Ford, DaimlerChrysler, General Motors, and Volkswagen, etc., are leveraging the numerous advantages of SOI-based chips across multiple applications and automotive networking protocols. Hence, these factors are expected to create lucrative opportunities for the players in the SOI ecosystem in near future.

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APAC to record the highest CAGR of the SOI market from 2021 to 2026

The SOI market in APAC is expected to record the highest CAGR during the forecast period. The growth of the market in APAC can be attributed to the rising demand for consumer electronics such as smartphones, tablets, laptops, and smart wearables. Moreover, the increased investments and expansions of several semiconductor foundry players and wafer manufacturers in this region are also fueling the growth of the SOI market in APAC. Additionally, a few of the major drivers for the growth of the SOI market in APAC include the prominence of the semiconductors industry in the region. The presence of key chip manufacturers and foundry players in APAC is expected to lead to increased demand for SOI wafers in the region, thereby contributing to the growth of the SOI market in APAC. Additionally, the high demand for consumer electronic devices in the region is also expected to contribute to the growth of the market in the region.

Key Market Players

Soitec (France); Shin-Etsu Chemical Co., Ltd. (Japan); GlobalWafers Co., Ltd. (Taiwan); SUMCO Corporation (Japan); Shanghai Simgui Technology Co., Ltd. (China); GLOBALFOUNDRIES (US); STMicroelectronics N.V. (Switzerland); Tower Semiconductor Ltd. (Israel); NXP Semiconductors N.V. (Netherlands); Murata Manufacturing Co., Ltd. (Japan); are some of the key players in the SOI market.