Meticulous Research®—a leading global market research firm—has published a comprehensive report titled, "Solid State Cooling Market by Type (Single, Multi, Thermocycler), Product (Refrigeration, Cooling), Technology (Thermoelectric, Electrocaloric), Application, End-use Industry - Global Forecast to 2031."
According to the report, the global solid state cooling market is projected to grow to $1.5 billion by 2031, with a compound annual growth rate (CAGR) of 9.8% from 2024 to 2031. Key drivers of this growth include the increasing demand for high energy-efficient cooling systems, the rising adoption of consumer electronics, and the growing use of solid state cooling in medical devices and healthcare applications. Additionally, the rising utilization of data centers and integration with renewable energy sources are expected to offer significant growth opportunities. Challenges such as the high initial costs of solid state cooling systems and the need for high-performance, cost-effective materials may restrain market growth.
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Market Segmentation and Insights:
• Type: The market is segmented into single-stage, multi-stage, and thermocycler systems. In 2024, single-stage systems are expected to dominate, accounting for over 48% of the market share. This is due to their simpler design and lower production costs. However, the thermocycler segment is projected to grow at the highest rate, driven by demand for precise temperature control in advanced biotechnological applications and diagnostics.
• Product: The market is divided into cooling systems and refrigeration systems. The cooling systems segment is anticipated to hold a major share of over 65% in 2024, owing to the demand for energy-efficient solutions in consumer electronics and industrial applications. Conversely, the refrigeration systems segment is expected to grow more rapidly, fueled by the need for eco-friendly, energy-efficient refrigeration solutions and advancements in technology.
• Technology: Key technologies include thermoelectric, magnetocaloric, electrocaloric, cryogenic, and others. Thermoelectric cooling is expected to lead with over 36% market share in 2024, thanks to its reliability and low maintenance. The electrocaloric cooling segment is projected to see the highest growth due to its compact size and high energy efficiency.
• Application: The market covers various applications including solid state refrigerators, heated & cooled mattresses, wine bottle coolers, and more. Solid state refrigerators are forecasted to hold the largest share of over 27% in 2024, while the thermal therapy devices segment is expected to grow the fastest, driven by the increasing demand for advanced, adjustable temperature control.
• End-use Industry: The market is segmented into automotive, food & beverages, aerospace & defense, semiconductor & electronics, IT & telecommunications, industrial/power generation, healthcare, and others. The healthcare segment is anticipated to dominate with over 43% market share in 2024, due to the need for advanced cooling in medical devices. The semiconductor & electronics segment is projected to experience the highest growth, driven by the demand for cooling solutions in high-performance computing and data centers.
• Geography: The market is divided into North America, Europe, Asia-Pacific, Latin America, and the Middle East & Africa. North America is expected to hold the largest share of over 42% in 2024, driven by advancements in electronics and medical sectors, while Asia-Pacific is anticipated to register the highest growth rate of over 11% during the forecast period.
Quick Buy – Solid State Cooling Market – Global Opportunity Analysis and Industry Forecast (2024-2031), Research Report: https://www.meticulousresearch.com/Checkout/85083867
Key Players:
Notable players in the solid state cooling market include Ferrotec Holdings Corporation (U.S.), TE Technology, Inc. (U.S.), AMS Technologies AG (Germany), Coherent Corp. (U.S.), Phononic, Inc. (U.K.), Solid State Cooling Systems (U.S.), EIC Solutions, Inc. (U.S.), Crystal Ltd. (Russia), Delta Electronics, Inc. (Taiwan), EVERREDtronics Ltd (China), Laird Thermal Systems, Inc. (U.S.), MERIT TECHNOLOGY GROUP Co., Ltd (China), TEC Microsystems GmbH (Germany), Thermonamic Electronics(Jiangxi) Corp., Ltd. (China), Kryotherm (Russia), Xiamen Hicool Electronics Co., Ltd. (China), Align Sourcing LLC (U.S.), and Hi-Z Technology, Inc. (U.S.).
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